V-Tec AT16/C5 Spécifications Page 11

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Si2400
Rev. 1.3 11
3. Bill of Materials
Component Value Suppliers
C1,C4
1
150 pF, 3 kV, X7R,±20% Novacap, Venkel, Johanson, Murata, Panasonic
C3,C13 0.22 µF, 16 V, X7R, ±20% Novacap, Venkel, Johanson, Murata, Panasonic
C5
2
0.1 µF, 50 V, Elec/Tant, ±20% Venkel, Johanson, Murata, Panasonic
C6,C10,C16 0.1 µF, 16 V, X7R, ±20% Novacap, Venkel, Johanson, Murata
C7,C8
3
560 pF, 250 V, X7R, ±20% Novacap, Venkel, Johanson, Murata, Panasonic
C9 22 nF, 250 V, X7R, ±20% Novacap, Venkel, Johanson, Murata, Panasonic
C12 1.0 µF, 16 V, Elec/Tant, ±20% Venkel, Panasonic
C14
2
0.68 µF, 16 V, X7R/Elec/Tant,
±20%
Novacap, Venkel, AUX, Murata, Panasonic
C18,C19
3
3.9 nF, 16 V, X7R, ±20% Novacap, Venkel, Johanson, Murata
C20 0.01 µF, 16 V, X7R, ±20% Novacap, Venkel, Johanson, Murata
C22
4
1800 pF, 50 V, X7R, ±20% Not installed
C24,C25
1
1000 pF, 3 kV, X7R, ±10% Novacap, Venkel, Johanson, Murata, Panasonic
C26,C27 33 pF, 16 V, NPO, ±5% Novacap, Venkel, Johanson, Murata
C30
4
10 pF, 16 V, NPO, ±10% Not Installed
C38,C39
2,5
47 pF, 16 V, X7R, ±10% Venkel
D1,D2
6
Dual Diode, 300 V, 225 mA Central Semiconductor
D3,D4
1
BAV99 Dual Diode, 70 V Diodes Inc., OnSemiconductor, Fairchild
FB1,FB2 Ferrite Bead, 600 Ω, ±25%,
200 mA
Murata
L1,L2
2,5
68 µH, 120 mA, 4 Ω max, ±10% TDK, Murata, Panasonic
Q1,Q3 A42, NPN, 300 V OnSemiconductor, Fairchild, Zetex
Q2 A92, PNP, 300 V OnSemiconductor, Fairchild, Zetex
Q4
7
BCP56, NPN, 60 V, 1/2 W OnSemiconductor, Fairchild
Notes:
1. The Si2400 design survives up to 3500 V longitudinal surges without R27, R28, D3, D4, Z4, and Z5. Adding the R27, R28, D3, D4, Z4,
Z5 enhanced lightning option increases longitudinal surge survival to greater than 6600 V. The isolation capacitors C1, C4, C24, and
C25 must also be rated to greater than the surge voltage. Y-class capacitors are recommended for highest surge survival and are
required for Norway, Sweden, Denmark, and Finland.
2. For FCC-only designs: C14, C38, C39, R12, R13, R31, and R32 are not required; L1 and L2 may be replaced with a short; R2 may be
±5%; with Z1 rated at 18 V, C5 may be rated at 16 V; also see note 9.
3. If the auto answer, ring detect, and caller ID features are not used, R9, R10, C7, C8, C18, and C19 may be removed. In this case, the
RNG1 and RNG2 pins of the Si3015 should be connected to the IGND pin.
4. C22 and C30 may provide an additional improvement in emissions/immunity and/or voice performance, depending on design and
layout. Population option recommended. See "Emissions/Immunity" on page 78.
5. Compliance with EN55022 and/or CISPR-22 conducted disturbance tests requires L1, L2, C38, C39, R31, R32, and RV2. See also
“EN55022 and CISPR-22 Compliance” in Appendix A.
6. Several diode bridge configurations are acceptable (suppliers include General Semi., Diodes Inc.).
7. Q4 may require copper on board to meet 1/2 W power requirement. (Contact manufacturer for details.)
8. When L1 and L2 are used, RV2 must be installed, and D1 and D2 must be 400 V.
9. The R7, R8, R15, and R16, R17, R19 resistors may each be replaced with a single resistor of 1.78 kΩ, 3/4 W, ±1%. For FCC-only
designs, 1.78 kΩ, 1/16 W, ±5% resistors may be used.
10. If the parallel phone detection feature is not used, R25 and R26 may be removed.
11. To ensure compliance with ITU specifications, frequency tolerance must be less than 100 ppm including initial accuracy, 5-year aging,
0 to 70°C, and capacitive loading.
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